{"id":1597,"date":"2025-06-03T16:45:58","date_gmt":"2025-06-03T09:45:58","guid":{"rendered":"https:\/\/htiscientific.vn\/?p=1597"},"modified":"2025-06-03T16:45:58","modified_gmt":"2025-06-03T09:45:58","slug":"quy-trinh-san-xuat-chip-ban-dan","status":"publish","type":"post","link":"https:\/\/htiscientific.vn\/en\/quy-trinh-san-xuat-chip-ban-dan\/","title":{"rendered":"Semiconductor Manufacturing Analytical Techniques"},"content":{"rendered":"

Accurate and reliable analysis of advanced semiconductors<\/span><\/h2>\n

As semiconductors and microelectronics get smaller, there\u2019s greater dependence on pure raw materials to ensure\nsuccessful manufacture. Semiconductor research and development managers are tasked with establishing the right\nset of process and selecting the right materials for the entire integrated circuitry (IC) manufacturing processes. The\nchoices and recommendations semiconductor R&D managers make today impact the operation\u2019s ability to achieve 24\/7\nmanufacturing operations and downstream production ROI.<\/span><\/p>\n

\"Ph\u00e1t<\/span><\/h2>\n

The research and manufacturing process of semiconductor chips involves 5 steps:<\/span><\/p>\n


\n1. R&D: Design and selection of lithography process. Consultation on the purity of materials and chemicals.
\n2. Material and chemical selection: Detection and monitoring of impurities in raw materials, processing chemicals, and gases used.
\n3. Chip fabrication: Impurity inspection at the receiving point for QA\/QC verification.
\n4. Facility environment: Cleanroom contamination prevention.
\n5. Assembly and packaging: QA\/QC of materials including epoxy resins, solder, molding compounds for bare die attach, wire bonding, encapsulation, lead trimming, plating, and final product inspection.<\/span><\/p>\n

\"Quy<\/span><\/h2>\n

Trong quy tr\u00ecnh s\u1ea3n xu\u1ea5t chip b\u00e1n d\u1eabn, t\u1eebng giai \u0111o\u1ea1n c\u00f3 y\u00eau c\u1ea7u v\u00e0 quy \u0111\u1ecbnh ph\u00e2n t\u00edch ri\u00eang v\u00e0 s\u1ebd t\u01b0\u01a1ng \u1ee9ng v\u1edbi t\u1eebng thi\u1ebft b\u1ecb ph\u00e2n t\u00edch ri\u00eang<\/span><\/p>\n


\n+ Ph\u00e2n t\u00edch t\u1ea1p ch\u1ea5t v\u00f4 c\u01a1: ph\u1ed5 nguy\u00ean t\u1eed NexION ICP-MS, Avio ICP-OES
\n+ Ph\u00e2n t\u00edch t\u1ea1p ch\u1ea5t h\u1eefu c\u01a1: h\u1ec7 th\u1ed1ng s\u1eafc k\u00fd GC, LC
\n+ X\u00e1c \u0111\u1ecbnh nguy\u00ean li\u1ec7u th\u00f4, nhi\u1ec5m b\u1ea9n c\u1ee7a wafer,.. s\u1eed d\u1ee5ng quang ph\u1ed5 h\u1ed3ng ngo\u1ea1i FTIR
\n+ \u0110\u1eb7c t\u00ednh v\u1eadt li\u1ec7u h\u00e0n, s\u1ef1 ph\u00e2n h\u1ee7y v\u00e0 tho\u00e1t kh\u00ed s\u1eed d\u1ee5ng c\u00e1c thi\u1ebft b\u1ecb ph\u00e2n t\u00edch nhi\u1ec7t
\n+ \u0110o \u0111\u1ed9 ph\u1ea3n x\u1ea1 v\u00e0 \u0111\u1ed9 truy\u1ec1n qua c\u1ee7a c\u00e1c m\u1eabu s\u1eed d\u1ee5ng UV\/Vis\/NIR<\/span><\/p>\n

\"Gi\u1ea3i<\/span><\/p>\n

 <\/p>\n

V\u1edbi danh m\u1ee5c thi\u1ebft b\u1ecb ph\u00e2n t\u00edch t\u1eeb\u00a0PerkinElmer<\/a>\u00a0h\u1ed7 tr\u1ee3 cho quy tr\u00ecnh nghi\u00ean c\u1ee9u v\u00e0 s\u1ea3n xu\u1ea5t chip b\u00e1n d\u1eabn.\u00a0HTI Scientific<\/a>\u00a0hi\u1ec7n l\u00e0 nh\u00e0 ph\u00e2n ph\u1ed1i ch\u00ednh th\u1ee9c c\u00e1c s\u1ea3n ph\u1ea9m c\u1ee7a PerkinElmer t\u1ea1i Vi\u1ec7t Nam\u00a0<\/span><\/p>\n

Li\u00ean h\u1ec7:\u00a0<\/strong><\/span><\/p>\n